Fraunhofer Institute for Applied Polymer Research IAP
Fraunhofer Institute for Applied Polymer Research IAP

Thermal analysis

During their production, processing and application polymers are often subjected to temperature-dependent structure changes. Thermal analysis allows the recording by measuring technique and a reliable characterization. Standard tests as well as non conformed tests are run. Special tests can be structured in accordance with the client. We assess the concrete problem of the client and run an experiment optimally adapted to the problem.

Analyte

 

  • solids, liquids, solutions, dispersions
  • sample amount: 6 mg - 10 mg

Equipment

 

  • dynamic scanning calorimeter DSC 7 (PerkinElmer)
  • temperature range: -150 bis 725 °C
  • measuring speed: 0.1 bis 100 K/min,
  • investigations isobar and isochor

Analysis and target

 

  • determination of specific heat capacity
  • determination of enthalpy changes
    (melting and crystallization points)
  • determination of glass transition
    temperatures
  • installation of phase diagrams
  • investigation of reaction mechanisms for non-isothermal processes
  • quality control
  • measurement of the thermal stability
  • measurement of viscoelasticity
  • determination of crystal water
  • investigation of crystallization kinetics

Applications

 

  • determination of melting and freezing points for setting optimal process
    parameters, e.g. for the injection molding process for thermoplastics
  • gelatinization points of aqueous starch products
  • failure analysis, for example detection of impurities in materials
  • determination of crosslinking
    temperatures, e.g. during crosslinking of epoxy resins

Differential
Scanning
Calorimetry (DSC)

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Dynamic
Mechanical
Analysis (DMA)

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Dynamic Mechanical Analysis (DMA)

Analyte

 

  • solids, foils, powders, granules, fibers,
    test bars, components, or component segments

Equipment

 

  • dynamic mechanical analyzor DMA 2980 (TA Instruments)
  • temperatur range: -150 - 500 °C
  • measuring speed: 0,01 - 10 K/min, isotherm
  • force field: 0 bis 18 N

Analysis and target

 

  • measurement of moduli depending on frequency, temperature or time
  • determination of complex moduli
  • determination of expansion coefficients
  • inclusion of master curves
  • determination of heat resistance

Applications

 

  • characterization of influence of additives, such as the heat distortion resistance
  • failure analysis, for example comparison of the module of component segments
  • characterization of the frequency dependency of memory and loss modulus

Differential Scanning Calorimetry (DSC)

Thermal analysis