Events and fairs

Shaping the future of electronics - additive, sustainable, flexible, hybrid, wearable, structural and 3D. We will be at TechBlick 2025 presenting our latest developments: exceptional color-stable quantum dots, inks for printed displays, display components, OLED displays as well as perovskite solar applications.

As part of the Fraunhofer Competence Field Additive Manufacturing, the Fraunhofer IAP will be presenting developments in the fields of artificial tissue from the 3D printer, innovative biomimetic materials, thermoresponsive connecting elements, sealing caps and morphing structures.